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Blog review July 21, 2014

New blogs discuss the best way to verify multi-IP, multiple power domain SoCs, contemplate what TSMC may have changed in 20nm devices from the 28nm generation, what happens when we ...

Blog review July 14, 2014

New blogs give several different perspectives on Moore’s Law and the potential for continued scaling, the persistent uncertainty of EUV lithography, the VLSI Symposia and FD-SOI, ...

Blog review June 30, 2014

New blogs review positive comments at The ConFab last week by IBM’s Gary Patton; next week’s Silicon Innovation Forum to held in conjunction with SEMICON West; an interview with ...

Top Stories

An EDA view of semiconductor manufacturing

The concern that there is a significant break between tools used by designers targeting leading edge processes, those at 32 nm and smaller to be precise, and those used to

3D memory for future nanoelectronic systems

Bit-growth slows while specialized stacking accelerates innovation in future memory solutions for communications, energy, and health-care.

Qualcomm: Scaling down is not cost-economic anymore - so we are looking at true monolithic 3D

Over the course of three major industry conferences (VLSI 2013, IEDM 2013 and DAC 2014), executives of Qualcomm voiced a call for monolithic 3D "to extend the semiconductor roadmap ...

ST licenses 28nm FD-SOI to Samsung

Samsung joins GLOBALFOUNDRIES in offering performance boost in 2D silicon.

Scouting report for materials at end of the road: 2013 ITRS

When pavement ends the terrain gets rough, as documented in Emerging Research Materials chapter of newest ITRS.

Technology Features

Feature Articles

Sustainability through Materials Recovery

Recovering and reusing materials is becoming an increasingly essential consideration in order to ensure consistent quality, a stable supply of materials, and lower costs. On- and off-site ...

Qualcomm: Scaling down is not cost-economic anymore – so we are looking at true monolithic 3D

Over the course of three major industry conferences (VLSI 2013, IEDM 2013 and DAC 2014), executives of Qualcomm voiced a call for monolithic 3D "to extend the semiconductor roadmap ...

IP interoperability in SoCs: Mix and match doesn’t always work

More often than not, a design re-spin isn’t just a simple re-spin with a tweak here and a tweak there. The new design will probably have to comply with modified

3D EDA brings together proven 2D solutions

Design methodologies and technologies for 2D multi-chip systems are extended into 3D using proprietary tools based on industry standards.

Safety critical devices drive fast adoption of advanced DFT

Devices used in safety critical applications such as automobiles need be known to work and have the ability to be regularly verified. Therefore, a very high-quality test is important ...

FinFET on SOI: Potential Becomes Reality

We report here empirical results demonstrating the electrical benefits of SOI-based FinFETs. There are benefits inherent in the elimination of dopant as the means to establish the effective ...

Eliminating the Challenges of Giga-Scale Circuit Design With Nano-Scale Technologies

Dr. Lianfeng Yang of ProPlus Design Solutions, Inc. says that the only way out of today's challenges is to more tightly integrate tools for nano-scale modeling, giga-scale SPICE simulation ...

Design for Yield Trends

Should foundries establish and share best practices to manage sub-nanometer effects to improve yield and also manufacturability?

Monte Carlo Analysis Has Become A Gamble

Years ago, someone overhead a group of us talking about Monte Carlo analysis and thought we were referring to the gambling center of Monaco and not computational algorithms that have ...

Model-Based Hints: GPS for LFD Success

For several technology nodes now, designers have been required to run lithography-friendly design (LFD) checks prior to tape out and acceptance by the foundry.

Round Tables

Roll over flat panel displays

Flexible displays is a technological field that has been in R&D and pre-commercial development for several years, but what needs to happen to make volume production a reality, in ...

Big sell: IP Trends and Strategies

Experts from Semico Research, Cadence, Uniquify and Sonics challenge growth trends for semiconductor intellectual property (SIP) with FinFETs, the IoT and more.

Experts At The Table: Commercial potential and production challenges for 3D NAND memory technology

In this roundtable discussion focused on 3D NAND , we hear from Samsung Electronics (SE) in South Korea, Bradley Howard, Vice President of Advanced Technology Group, Etch Business Unit, ...

Experts At The Table: Exploring the relationship between board-level design and 3D, and stacked, dies

SemiMD discussed what board level design can tell us about chip-level (three-dimensional) 3D and stacked dies with Sesh Ramaswami, Applied Materials’ Managing Director, TSV and Advanced ...

Experts At The Table: Design For Yield (DFY) moves closer to the foundry/manufacturing side

SemiMD discussed the trend for design for yield (DFY) moving closer to the foundry/manufacturing side with Dr Bruce McGaughy, Chief Technology Officer and Senior Vice President of Engineering, ...

Experts Roundtable: More than Moore – manufacturing challenges for MEMS

Semiconductor Design & Manufacturing discussed ‘More than Moore‘ (MtM) standardization topics and challenges with Peter Himes, VP of marketing and strategic alliances ...

Podcasts/Videos/Webcasts

Solid State Watch: June 27-July 3, 2014

Gigaphoton achieves 92W EUV light source output; New graphene substitute has HVM potential; SMIC and Qualcomm collaborate; Nanolab Technologies acquires Microtech

Solid State Watch: June 13-19, 2014

Inpria completes another round of financing; GS Nanotech to launch mass assembly of 3D TSVs; memsstar relocates; Entegris launches i2M Center

Solid State Watch: June 6-12, 2014

Entropic consolidation; Field-effect transistor research, 2014 Symposium on VLSI Technology; ON Semiconductor to acquire Aptina Imaging

Solid State Watch: May 30-June 5, 2014

Fab equipment spending increase; SID announces winners of Display Industry Awards; Samsung's 14nm finFET process technology ready; Synopsys, Intel and ST collaborate on 28nm FD-SOI ...

Solid State Watch: May 23-29, 2014

STATSChipPAC releases new encapsulated wafer level chip scale package; Applied Materials reveals the Endura Ventura PVD system; Ziptronix and EV Group achieve submicron post-bond alignment ...

Solid State Watch: May 16-22, 2014

Increase in first quarter wafer shipments; Changes to the top 25 semiconductor suppliers; IC Advanced Technology Research Institute; The 17th annual IITC held this week

Solid State Watch: May 9-15, 2014

STMicroelectronics licenses 28nm FD-SOI to Samsung; DoD policy to reduce counterfeit semiconductors; OLED market growth; Applied Materials releases new CVD system

Solid State Watch: May 2-8, 2014

SEMATECH announces EUV milestone; First quarter semi sales highest ever; UC Berkeley and SRC pursue 3D integration research; GlobalFoundries launches platform for automotive industry ...

Solid State Watch: April 25-May 1, 2014

Sensor hub growth; Samsung's new NAND-based SSD; Brooks acquires DMS; New rapid synthesis developed for bilayer graphene and high-performance transistors

Solid State Watch: April 18-25, 2014

Altera and TSMC collaborate; Cadence to acquire Jasper; SanDisk's donation to University of California; Permanent bonding market report