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MicroWatt Chips shown at ISSCC

With much of future demand for silicon ICs forecasted to be for mobile devices that must conserve battery power, it was natural for much of the focus at the just

Time to “shift left” in chip design and verification, Synopsys founder says

Taking “Smart Design from Silicon to Software” as his official theme, Aart de Geus urged attendees to “shift left” – in other words, “squeezing the schedule” to design, ...

SPIE Advanced Lithography conference concludes

Exposures, and reducing their cost, were a theme running through the 2015 SPIE Advanced Lithography Symposium this week in San Jose, Calif., the center of Silicon Valley.

Learning to live with negative tone

In lithography for manufacturing semiconductors, a negative tone can be a positive attribute.

Directed Self Assembly Hot Topic at SPIE

At this week’s SPIE Advanced Lithography Symposium in San Jose, Calif., the hottest three-letter acronym is less EUV and more DSA, as in directed self-assembly.

Proponents of EUV, immersion lithography face off at SPIE

The two main camps in optical lithography are arrayed for battle at the SPIE Advanced Lithography Symposium. EUVt lithography, on one side, is represented by ASML Holding, its Cymer ...



News Stories

Time to “shift left” in chip design and verification, Synopsys founder says

Taking “Smart Design from Silicon to Software” as his official theme, Aart de Geus urged attendees to “shift left” – in other words, “squeezing the schedule” to design, ...

SPIE Advanced Lithography conference concludes

Exposures, and reducing their cost, were a theme running through the 2015 SPIE Advanced Lithography Symposium this week in San Jose, Calif., the center of Silicon Valley.

Learning to live with negative tone

In lithography for manufacturing semiconductors, a negative tone can be a positive attribute.

Technology Features

Feature Articles

MicroWatt Chips shown at ISSCC

With much of future demand for silicon ICs forecasted to be for mobile devices that must conserve battery power, it was natural for much of the focus at the just

Changes and Challenges Abound in Multi-patterning Lithography

Multi-patterning lithography is a fact of life for many chipmakers. Experts in the fields of electronic design automation and lithography address the issues associated with the technology. ...

Experts at the Table: Focus on Semiconductor Materials

The cutting edge in semiconductor manufacturing has meant not only big changes in IC design and process technology, but also in semiconductor materials. Experts weigh in from Linde ...

Experts at the Table: Focus on Semiconductor Materials

The cutting edge in semiconductor manufacturing has meant not only big changes in IC design and process technology, but also in semiconductor materials. Experts weigh in from Linde ...

Monolithic 3D breakthrough at IEEE S3S 2014

In the upcoming 2014 IEEE S3S conference (October 6-9), MonolithIC 3D will unveil a breakthrough flow that is game-changing for 3D IC. For the first time ever monolithic 3D (“M3DI”) ...

Process Watch: Sampling matters

Determining an optimum sampling strategy comes down to weighing the cost of process control against the benefit of capturing the defect or other excursion in a timely manner.

Foundry, EDA partnership eases move to advanced process nodes

A leading semiconductor foundry and an EDA vendor with design-for-yield (DFY) solutions have enjoyed a long-term partnership. Recently, they worked together to leverage DFY technologies ...

Sustainability through Materials Recovery

Recovering and reusing materials is becoming an increasingly essential consideration in order to ensure consistent quality, a stable supply of materials, and lower costs. On- and off-site ...

Qualcomm: Scaling down is not cost-economic anymore - so we are looking at true monolithic 3D

Over the course of three major industry conferences (VLSI 2013, IEDM 2013 and DAC 2014), executives of Qualcomm voiced a call for monolithic 3D "to extend the semiconductor roadmap ...

IP interoperability in SoCs: Mix and match doesn’t always work

More often than not, a design re-spin isn’t just a simple re-spin with a tweak here and a tweak there. The new design will probably have to comply with modified

Podcasts/Videos/Webcasts

Solid State Watch: February 20-26, 2015

Top R&D spenders announced; Applied Materials unveils 3D CD SEM metrology tool; Smartphone display panel manufacturers face pressure to reduce prices; Semiconductor unit shipments ...

Solid State Watch: February 13-19, 2015

imec announces DSA process technology breakthrough; GlobalFoundries and imec announce partnership; January book-to-bill released; Samsung announces mass production of mobile application ...

Solid State Watch: February 6-12, 2015

Slow progress on Applied Materials-Tokyo Electron merger; Silicon wafer area shipments increased 11% in 2014; SEMI wins semiconductor etch equipment export control ruling; One-atom-thin ...

Solid State Watch: January 30-February 5, 2015

Semiconductor industry posts record sales in 2014; SEMICON Korea opened this week; ClassOne Technology acquires two product lines from Microprocess Technologies; Cambridge Nanotherm ...

Solid State Watch: January 23-29, 2015

Solid growth in automotive semiconductor market; $4M grant to UMass Lowell for printed and flexible electronics development; Book-to-bill ratio below parity; Researchers use oxides ...

Solid State Watch: January 16-22, 2015

SUNY Poly announces founding president; Solving an organic semiconductor mystery; UC Berkeley Extension announces new semiconductor IC program; 2015 tech trends and drivers

Solid State Watch: January 9-15, 2015

Blue LED research shines light on manufacturing problems; SEMI World Fab Forecast data shows favorable DRAM growth; The technology that will change the world; GlobalFoundries and Linear ...

Solid State Watch: January 1-8, 2015

Semiconductor market revenue on track for 9.4 percent expansion; Graphene mystery solved; November 2014 semiconductor sales reach $29.7B; ON Semiconductor showcases new CMOS imaging ...

Solid State Watch: December 12-19, 2014

Book-to-bill above parity in November; imec demonstrates graphene EAM on IEDM 2014; Amkor licenses copper pillar wafer bump tech to GLOBALFOUNDRIES; Desktop monitor market experiences ...

Solid State Watch: December 5-11, 2014

Murata completes acquisition of Peregrine; North Carolina State University researches stacking semiconductor materials; SIA announces new president and CEO; Entegris announces availability ...