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Samsung to put 10nm chips into mass production by end of 2016

Samsung Semiconductor on Thursday announced that it will have 10-nanometer FinFET chips in volume production by the end of next year.

New Applied PVD system targets TiN hardmasks for 10nm, 7nm chips

Applied Materials introduced the Applied Endura Cirrus HTX PVD, a physical vapor deposition system for creating titanium nitride hardmask films that could be used in fabricating 10-nanometer ...

It’s blue skies for Jabil and its customers

While making printed circuit boards is still a big business for the St. Petersburg, Fla.-based Jabil, which boasts 90 plants in 24 countries around the world, the Blue Sky Center

Safe CMP slurries for future IC materials

New CMP processes for new materials planned to be used in building future IC devices are now in R&D. Early data on process trade-offs as well as on EHS aspects

ITRS 2.0: Top-Down System Integration

ITRS2.0 will, for the first time, develop a top-down system-driven roadmap framework for key semiconductor industry drivers in the 2015-2030 period.

Silicon Summit speakers look at the future of chip technology

GSA's Silicon Summit at the Computer History Museum in Mountain View, Calif., not far from Google’s headquarters, was dominated by talk of IoT, AR, VR, and (to a lesser



News Stories

Samsung to put 10nm chips into mass production by end of 2016

Samsung Semiconductor on Thursday announced that it will have 10-nanometer FinFET chips in volume production by the end of next year.

New Applied PVD system targets TiN hardmasks for 10nm, 7nm chips

Applied Materials introduced the Applied Endura Cirrus HTX PVD, a physical vapor deposition system for creating titanium nitride hardmask films that could be used in fabricating 10-nanometer ...

Danaher to buy Pall in $13.8B deal

Danaher Corporation announced that it will acquire Pall Corporation for $13.8 billion. Once the transaction is completed, the merged company plans to split into two publicly traded ...

Technology Features

Feature Articles

ITRS 2.0: Top-Down System Integration

ITRS2.0 will, for the first time, develop a top-down system-driven roadmap framework for key semiconductor industry drivers in the 2015-2030 period.

SOI: Revolutionizing RF and expanding in to new frontiers

SOI provides the capability to revolutionize RF Front Ends and WAN RFSOCs through innovation in radio architectures.

MicroWatt Chips shown at ISSCC

With much of future demand for silicon ICs forecasted to be for mobile devices that must conserve battery power, it was natural for much of the focus at the just

Changes and Challenges Abound in Multi-patterning Lithography

Multi-patterning lithography is a fact of life for many chipmakers. Experts in the fields of electronic design automation and lithography address the issues associated with the technology. ...

Experts at the Table: Focus on Semiconductor Materials

The cutting edge in semiconductor manufacturing has meant not only big changes in IC design and process technology, but also in semiconductor materials. Experts weigh in from Linde ...

Experts at the Table: Focus on Semiconductor Materials

The cutting edge in semiconductor manufacturing has meant not only big changes in IC design and process technology, but also in semiconductor materials. Experts weigh in from Linde ...

Monolithic 3D breakthrough at IEEE S3S 2014

In the upcoming 2014 IEEE S3S conference (October 6-9), MonolithIC 3D will unveil a breakthrough flow that is game-changing for 3D IC. For the first time ever monolithic 3D (“M3DI”) ...

Process Watch: Sampling matters

Determining an optimum sampling strategy comes down to weighing the cost of process control against the benefit of capturing the defect or other excursion in a timely manner.

Foundry, EDA partnership eases move to advanced process nodes

A leading semiconductor foundry and an EDA vendor with design-for-yield (DFY) solutions have enjoyed a long-term partnership. Recently, they worked together to leverage DFY technologies ...

Sustainability through Materials Recovery

Recovering and reusing materials is becoming an increasingly essential consideration in order to ensure consistent quality, a stable supply of materials, and lower costs. On- and off-site ...

Podcasts/Videos/Webcasts

Solid State Watch: May 1-8, 2015

First quarter semiconductor sales up 6% compared to last year; New study suggests that rapid innovation in semiconductors provides hope for better economic times ahead; Microchip and ...

Solid State Watch: April 24-30, 2015

Applied Materials and Tokyo Electron terminate merger; Sensor competition, actuator recovery impact supplier ranking; Georgia Tech research offers novel cellular sensing platform for ...

Solid State Watch: April 17-23, 2015

Top 10 2015 semiconductor sales leaders forecast to include NXP/Freescale; Applied Materials announces new photomask etch system; North American semiconductor equipment industry posts ...

Solid State Watch: April 10-16, 2015

SEMI reports 2014 semiconductor photomask sales of $3.2B; Automotive touch panel revenues to hit $1.5B by 2018; Sensor shipments strengthen but falling prices cut sales growth; ClassOne ...

Solid State Watch: April 3-9, 2015

SEMI reports 2014 global semiconductor materials sales of $44.3B; Cavendish Kinetics adopts STATS ChipPAC’s wafer level technology; MEMS shipments to reach 43.3B units by 2018; TSMC ...

Solid State Watch: March 27-April 2, 2015

NXP/Freescale merger to create an automotive semiconductor giant; Mentor Graphics releases new Xpedition Packaging Integrator flow; C3Nano and Kimoto Japan announce partnership; Brown ...

Solid State Watch: March 20-26, 2015

Top 20 MEMS ranking revealed; Micron and Intel announce availability of their 3D NAND technology; GlobalFoundries and NXP Semiconductor develop a 40nm eNVM low-power process technology; ...

Solid State Watch: March 13-19, 2015

Small powerful systems give rise to medical semiconductor sales; Recovering economies driving growth in the industrial semiconductor market; NXP-Freescale merger to result in world’s ...

Solid State Watch: March 6-12, 2015

Cypress and Spansion complete merger; Strong fab equipment spending forecast for 2015; 11 IC product categories to exceed total IC market growth in 2015; Global mobile phone display ...

Solid State Watch: February 27-March 5, 2015

NXP and Freescale announce merger; Semiconductor Industry Association announces highest January sales ever; UT Dallas research could lead to affordable night vision and thermal imaging; ...