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Breaking Down Power Management Verification

During system-level verification, it is imperative to verify that the software power control applications properly initialize power states and power domains.

3DIC Technology Drivers and Roadmaps

Circuit performance and silicon area improvements seen in new die stacks.

Power shift reflects the need for a new way of thinking

Handheld and smart devices are driving a methodology shift in power analysis. Mentor Graphics has recognized the need to calculate power values earlier in the design cycle, and has ...

Veloce Redefines Power Analysis Flow

Mentor Graphics Corp. released the Veloce® Power Application software that enables accurate, timely and efficient power analysis at the system, RTL and gate level for complex SoC designs. ...

Tackling Parameter Extraction for 16nm and Below

There are four reasons why parasitic parameter extraction is getting a lot harder for 16nm and below technology nodes: 1) 3D device geometries, such as the finFET, which result in

Conference features the latest in flexible display technology

At Display Week 2015, bigger is better. Smaller is better. And flexible may be best of all, for the era of wearable electronics.



News Stories

Veloce Redefines Power Analysis Flow

Mentor Graphics Corp. released the Veloce® Power Application software that enables accurate, timely and efficient power analysis at the system, RTL and gate level for complex SoC designs. ...

Tackling Parameter Extraction for 16nm and Below

There are four reasons why parasitic parameter extraction is getting a lot harder for 16nm and below technology nodes: 1) 3D device geometries, such as the finFET, which result in

Conference features the latest in flexible display technology

At Display Week 2015, bigger is better. Smaller is better. And flexible may be best of all, for the era of wearable electronics.

Technology Features

Feature Articles

EMC2015 - New Devices, Old Tricks

The 57th annual Electronic Materials Conference, held June 24-26 in Columbus, Ohio, showcased research and development (R&D) of new device structures, as well as new insights into ...

3DIC Technology Drivers and Roadmaps

Circuit performance and silicon area improvements seen in new die stacks.

Power shift reflects the need for a new way of thinking

Handheld and smart devices are driving a methodology shift in power analysis. Mentor Graphics has recognized the need to calculate power values earlier in the design cycle, and has ...

Silicon Technology Extensions shown at MRS Spring 2015

New ultra-fast crystallization using lasers or plasma-jets.

ITRS 2.0: Top-Down System Integration

ITRS2.0 will, for the first time, develop a top-down system-driven roadmap framework for key semiconductor industry drivers in the 2015-2030 period.

SOI: Revolutionizing RF and expanding in to new frontiers

SOI provides the capability to revolutionize RF Front Ends and WAN RFSOCs through innovation in radio architectures.

MicroWatt Chips shown at ISSCC

With much of future demand for silicon ICs forecasted to be for mobile devices that must conserve battery power, it was natural for much of the focus at the just

Changes and Challenges Abound in Multi-patterning Lithography

Multi-patterning lithography is a fact of life for many chipmakers. Experts in the fields of electronic design automation and lithography address the issues associated with the technology. ...

Experts at the Table: Focus on Semiconductor Materials

The cutting edge in semiconductor manufacturing has meant not only big changes in IC design and process technology, but also in semiconductor materials. Experts weigh in from Linde ...

Experts at the Table: Focus on Semiconductor Materials

The cutting edge in semiconductor manufacturing has meant not only big changes in IC design and process technology, but also in semiconductor materials. Experts weigh in from Linde ...

Podcasts/Videos/Webcasts

Solid State Watch: June 19-25, 2015

IHS says Moore’s Law led to trillions added in global economy; Cadence and Applied Materials collaborate on CMP process optimization; Power transistors seen stabilizing and setting ...

Solid State Watch: June 12-18, 2015

Fab equipment growth continues in 2015; Fairchild launches first MEMS product, IC manufacturers close or repurpose 83 wafer fabs from 2009-2014; World’s thinnest light bulb made on ...

Solid State Watch: June 5-11, 2015

SEMI updates World Fab Forecast; MEMS suppliers ride auto safety wave; Seven partners join CEA-Leti’s FD-SOI IC development program; TSMC on 10nm process node

Solid State Watch: May 1-8, 2015

First quarter semiconductor sales up 6% compared to last year; New study suggests that rapid innovation in semiconductors provides hope for better economic times ahead; Microchip and ...

Solid State Watch: April 24-30, 2015

Applied Materials and Tokyo Electron terminate merger; Sensor competition, actuator recovery impact supplier ranking; Georgia Tech research offers novel cellular sensing platform for ...

Solid State Watch: April 17-23, 2015

Top 10 2015 semiconductor sales leaders forecast to include NXP/Freescale; Applied Materials announces new photomask etch system; North American semiconductor equipment industry posts ...

Solid State Watch: April 10-16, 2015

SEMI reports 2014 semiconductor photomask sales of $3.2B; Automotive touch panel revenues to hit $1.5B by 2018; Sensor shipments strengthen but falling prices cut sales growth; ClassOne ...

Solid State Watch: April 3-9, 2015

SEMI reports 2014 global semiconductor materials sales of $44.3B; Cavendish Kinetics adopts STATS ChipPAC’s wafer level technology; MEMS shipments to reach 43.3B units by 2018; TSMC ...

Solid State Watch: March 27-April 2, 2015

NXP/Freescale merger to create an automotive semiconductor giant; Mentor Graphics releases new Xpedition Packaging Integrator flow; C3Nano and Kimoto Japan announce partnership; Brown ...

Solid State Watch: March 20-26, 2015

Top 20 MEMS ranking revealed; Micron and Intel announce availability of their 3D NAND technology; GlobalFoundries and NXP Semiconductor develop a 40nm eNVM low-power process technology; ...