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It’s blue skies for Jabil and its customers

While making printed circuit boards is still a big business for the St. Petersburg, Fla.-based Jabil, which boasts 90 plants in 24 countries around the world, the Blue Sky Center

Safe CMP slurries for future IC materials

New CMP processes for new materials planned to be used in building future IC devices are now in R&D. Early data on process trade-offs as well as on EHS aspects

ITRS 2.0: Top-Down System Integration

ITRS2.0 will, for the first time, develop a top-down system-driven roadmap framework for key semiconductor industry drivers in the 2015-2030 period.

Silicon Summit speakers look at the future of chip technology

GSA's Silicon Summit at the Computer History Museum in Mountain View, Calif., not far from Google’s headquarters, was dominated by talk of IoT, AR, VR, and (to a lesser

Monolithic 3D processing using non-equilibrium RTP

Qualcomm endorses CEA-Leti’s “CoolCube” transistor stacking approach.

Deeper Dive: Xpedition Enables Co-Design of Chips, Packages, Boards

A new product from Mentor Graphics called Xpedition® Package Integrator provides a new methodology and platform in addition to a new suite of EDA tools. The platform enables chip, ...



News Stories

It’s blue skies for Jabil and its customers

While making printed circuit boards is still a big business for the St. Petersburg, Fla.-based Jabil, which boasts 90 plants in 24 countries around the world, the Blue Sky Center

Safe CMP slurries for future IC materials

New CMP processes for new materials planned to be used in building future IC devices are now in R&D. Early data on process trade-offs as well as on EHS aspects

Silicon Summit speakers look at the future of chip technology

GSA's Silicon Summit at the Computer History Museum in Mountain View, Calif., not far from Google’s headquarters, was dominated by talk of IoT, AR, VR, and (to a lesser

Technology Features

Feature Articles

ITRS 2.0: Top-Down System Integration

ITRS2.0 will, for the first time, develop a top-down system-driven roadmap framework for key semiconductor industry drivers in the 2015-2030 period.

SOI: Revolutionizing RF and expanding in to new frontiers

SOI provides the capability to revolutionize RF Front Ends and WAN RFSOCs through innovation in radio architectures.

MicroWatt Chips shown at ISSCC

With much of future demand for silicon ICs forecasted to be for mobile devices that must conserve battery power, it was natural for much of the focus at the just

Changes and Challenges Abound in Multi-patterning Lithography

Multi-patterning lithography is a fact of life for many chipmakers. Experts in the fields of electronic design automation and lithography address the issues associated with the technology. ...

Experts at the Table: Focus on Semiconductor Materials

The cutting edge in semiconductor manufacturing has meant not only big changes in IC design and process technology, but also in semiconductor materials. Experts weigh in from Linde ...

Experts at the Table: Focus on Semiconductor Materials

The cutting edge in semiconductor manufacturing has meant not only big changes in IC design and process technology, but also in semiconductor materials. Experts weigh in from Linde ...

Monolithic 3D breakthrough at IEEE S3S 2014

In the upcoming 2014 IEEE S3S conference (October 6-9), MonolithIC 3D will unveil a breakthrough flow that is game-changing for 3D IC. For the first time ever monolithic 3D (“M3DI”) ...

Process Watch: Sampling matters

Determining an optimum sampling strategy comes down to weighing the cost of process control against the benefit of capturing the defect or other excursion in a timely manner.

Foundry, EDA partnership eases move to advanced process nodes

A leading semiconductor foundry and an EDA vendor with design-for-yield (DFY) solutions have enjoyed a long-term partnership. Recently, they worked together to leverage DFY technologies ...

Sustainability through Materials Recovery

Recovering and reusing materials is becoming an increasingly essential consideration in order to ensure consistent quality, a stable supply of materials, and lower costs. On- and off-site ...

Podcasts/Videos/Webcasts

Solid State Watch: April 17-23, 2015

Top 10 2015 semiconductor sales leaders forecast to include NXP/Freescale; Applied Materials announces new photomask etch system; North American semiconductor equipment industry posts ...

Solid State Watch: April 10-16, 2015

SEMI reports 2014 semiconductor photomask sales of $3.2B; Automotive touch panel revenues to hit $1.5B by 2018; Sensor shipments strengthen but falling prices cut sales growth; ClassOne ...

Solid State Watch: April 3-9, 2015

SEMI reports 2014 global semiconductor materials sales of $44.3B; Cavendish Kinetics adopts STATS ChipPAC’s wafer level technology; MEMS shipments to reach 43.3B units by 2018; TSMC ...

Solid State Watch: March 27-April 2, 2015

NXP/Freescale merger to create an automotive semiconductor giant; Mentor Graphics releases new Xpedition Packaging Integrator flow; C3Nano and Kimoto Japan announce partnership; Brown ...

Solid State Watch: March 20-26, 2015

Top 20 MEMS ranking revealed; Micron and Intel announce availability of their 3D NAND technology; GlobalFoundries and NXP Semiconductor develop a 40nm eNVM low-power process technology; ...

Solid State Watch: March 13-19, 2015

Small powerful systems give rise to medical semiconductor sales; Recovering economies driving growth in the industrial semiconductor market; NXP-Freescale merger to result in world’s ...

Solid State Watch: March 6-12, 2015

Cypress and Spansion complete merger; Strong fab equipment spending forecast for 2015; 11 IC product categories to exceed total IC market growth in 2015; Global mobile phone display ...

Solid State Watch: February 27-March 5, 2015

NXP and Freescale announce merger; Semiconductor Industry Association announces highest January sales ever; UT Dallas research could lead to affordable night vision and thermal imaging; ...

Solid State Watch: February 20-26, 2015

Top R&D spenders announced; Applied Materials unveils 3D CD SEM metrology tool; Smartphone display panel manufacturers face pressure to reduce prices; Semiconductor unit shipments ...

Solid State Watch: February 13-19, 2015

imec announces DSA process technology breakthrough; GlobalFoundries and imec announce partnership; January book-to-bill released; Samsung announces mass production of mobile application ...