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Top Stories

Air-gaps in Copper Interconnects for Logic

Intel’s “14nm-node” process uses air-gaps in dielectrics; direction disclosed four years ago.

RF and MEMS Technologies to Enable the IoT

Communications and energy-harvesting capabilities can be integrated into ubiquitous always-on smart nodes.

Are We At an Inflection Point with Silicon Scaling and Homogeneous ICs?

In the late 1940’s, three physicists (Bardeen, Brattain and Shockley) invented the first transistor and were later awarded the Nobel Prize in 1956.

TSV Market Demand Now for Performance not Size

High-performance applications pull for premium packaging solutions.

ASML on EUV: Available at 10nm

Extreme-ultraviolet lithography systems will be available to pattern critical layers of semiconductors at the 10-nanometer process node, and EUV will completely take over from 193nm ...

Design and Manufacturing Technology Development in Future IC Foundries

Virtual Roundtable provides perspective on the need for greater integration within the “fabless-foundry” ecosystem.

News Stories

The Week in Review: November 21, 2014

China and US boost industrial semiconductor market growth; Global notebook PC market grows; Book-to-bill report shows another month below parity; Holst Center and Cartamundi develop ...

NFC IGZO TFT for Game Cards

Holst Centre, imec, and Cartamundi work on flexible Near Field Communication tags embedded in paper cards.

Applied Materials Q4 Report

Applied Materials reported today that its long-pending merger with Tokyo Electron Ltd. may not close until the first quarter of 2015.

Technology Features

Feature Articles

Experts at the Table: Focus on Semiconductor Materials

The cutting edge in semiconductor manufacturing has meant not only big changes in IC design and process technology, but also in semiconductor materials. Experts weigh in from Linde ...

Experts at the Table: Focus on Semiconductor Materials

The cutting edge in semiconductor manufacturing has meant not only big changes in IC design and process technology, but also in semiconductor materials. Experts weigh in from Linde ...

Monolithic 3D breakthrough at IEEE S3S 2014

In the upcoming 2014 IEEE S3S conference (October 6-9), MonolithIC 3D will unveil a breakthrough flow that is game-changing for 3D IC. For the first time ever monolithic 3D (“M3DI”) ...

Process Watch: Sampling matters

Determining an optimum sampling strategy comes down to weighing the cost of process control against the benefit of capturing the defect or other excursion in a timely manner.

Foundry, EDA partnership eases move to advanced process nodes

A leading semiconductor foundry and an EDA vendor with design-for-yield (DFY) solutions have enjoyed a long-term partnership. Recently, they worked together to leverage DFY technologies ...

Sustainability through Materials Recovery

Recovering and reusing materials is becoming an increasingly essential consideration in order to ensure consistent quality, a stable supply of materials, and lower costs. On- and off-site ...

Qualcomm: Scaling down is not cost-economic anymore - so we are looking at true monolithic 3D

Over the course of three major industry conferences (VLSI 2013, IEDM 2013 and DAC 2014), executives of Qualcomm voiced a call for monolithic 3D "to extend the semiconductor roadmap ...

IP interoperability in SoCs: Mix and match doesn’t always work

More often than not, a design re-spin isn’t just a simple re-spin with a tweak here and a tweak there. The new design will probably have to comply with modified

Roll over flat panel displays

Flexible displays is a technological field that has been in R&D and pre-commercial development for several years, but what needs to happen to make volume production a reality, in ...

3D EDA brings together proven 2D solutions

Design methodologies and technologies for 2D multi-chip systems are extended into 3D using proprietary tools based on industry standards.


Solid State Watch: October 31-November 6, 2014

The growing sensors market; Texas Instruments to expand operations in China; GlobalFoundries partners in INVECAS; Worldwide sales of semiconductors hits record-breaking high ...

Solid State Watch: October 23-30, 2014

GLOBALFOUNDRIES to take over IBM's commercial semi business; MegaChips acquires SiTime; imec and Coventor collaborate; Mergers and acquisitions shake up automotive semiconductor landscape ...

Solid State Watch: SEMICON Europa Special Edition

Pete Singer interviews new CEA-Leti CEO in Grenoble, France.

Solid State Watch: Sept. 25-Oct. 3, 2014

TSMC's new low-power tech platform and ARM-based networking processor with finFET technology; New 3D IC being researched; Dow Corning offering new 150mm SiC wafers

Solid State Watch: September 12-18, 2014

EUV available at 10nm; Mentor Graphics appoints new VP of Embedded Systems; ProPlus expands operations in Europe; Rudolph releases new SONUS technology

Solid State Watch: September 5-11, 2014

Front end fab equipment spending to increase in 2015; SEMI wins request for etch equipment export control review; GaAs device revenues on the rise; GlobalFoundries announces research ...

Solid State Watch: August 29-September 4, 2014

New biosensing material from UC Santa Barbara researchers; Contour Semi awarded new patents; New CEO at Fujitsu Semiconductor America; UMC joins Fujitsu's new foundry company

Solid State Watch: August 22-28, 2014

Fairchild Semiconductor closes two facilities; Intel releases new packaging technologies, Thinnest-possible semiconductor material; New metrology tools from KLA-Tencor

Solid State Watch: August 15-22, 2014

Silicon wafer shipments increase; The growing semiconductor industry in India; Equipment book-to-bill ratio remains steady; Next-generation smart glasses in development

Solid State Watch: July 31-August 7, 2014

Global semi sales hit record high; Benchmark established for EUV; Semiconductors for health and fitness set for double-digit growth; Smart cities on the rise